F4B High Frequency PCB DK 4.4 PTFE Microwave PCB 6.0mm RF PCB With Immersion Tin
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
This product(F4BTM-1/2) is made of glass fiber cloth, nano-grade ceramic powder filling material and PTFE resin through scientific preparation and strict process suppression. The heat dissipation effect has been somewhat improved, and the thermal expansion coefficient is small. Dielectric constant ranges 2.55 to 10.2. This is also a type of thick PCB material as thick as 12mm. Here’s the typical properties of F4BTM-1/2 as follows.
Typical Properties (F4BTM-1/2)
| Appearance | It complies with the national military standard regulations of microwave printed circuit substrate materials |
| Part No. | F4BTM-1/2 (255) | F4BTM-1/2 (265) | F4BTM-1/2 (285) | F4BTM-1/2 (294) | F4BTM-1/2 (300) | F4BTM-1/2 (320) |
| F4BTM-1/2 (338) | F4BTM-1/2 (350) | F4BTM-1/2 (400) | F4BTM-1/2 (440) | F4BTM-1/2 (615) | F4BTM-1/2 (1020) |
| Sheet Size(mm) | 610 x 460 | 600 x 500 | 1220 x 914 | 1220 x 1000 | 1500 x 1000 | |
| Dielectric Thickness(mm) | 0.254 ±0.025 | 0.508 ±0.05 | 0.762 ±0.05 | 0.787 ±0.05 | 1.016 ±0.05 | 1.27 ±0.05 |
| 1.524 ±0.05 | 2.0 ±0.075 | 3.0 ±0.09 | 4.0 ±0.1 | 5.0 ±0.1 | 6.0 ±0.12 |
| 9.0 ±0.18 | 10.0 ±0.18 | 12.0 ±0.2 | | | |
| Exfoliation strength of copper foil | Normal state ≧18N/cm; Constant heat and humidity and 265℃ ±2℃ melt solder foaming for 20 seconds, no delamination and peeling strength ≧15N/cm |
| Thermal Stress | Tin immersion, 260℃ x 10 seconds ≧3 times, no delamination, no bubble. |
| Chemical Properties | According to the substrate characteristics, reference to the printed circuit chemical corrosion method processing circuit, and the dielectric performance of the material does not change, the hole metalliczation requires nanaphthalene solution activation treatment or plasma treatment. |
| Physical and electrical performance | Property | Test Condition | Unit | Value |
| Density | Normal | g/cm³ | 2.1-3.0 |
| Water Absorption | Dip in 20℃±2℃ distilled water for 24 hours | % | ≦0.05 |
| Operation Temperature | High and low temperature box | ℃ | -50~+260 |
| Coefficient of thermal conductivity | | W/(m·K) | 0.6 - 0.9 |
| Coefficient of Thermal Expansion | -55℃ ~288℃ (DK 2.55~3.0) | ppm/℃ | x | 15 |
| y | 15 |
| z | 65 |
| Coefficient of Thermal Expansion | -55℃ ~288℃ (DK 3.2~3.5) | ppm/℃ | x | 15 |
| y | 15 |
| z | 55 |
| Coefficient of Thermal Expansion | -55℃ ~288℃ (DK 4.0~10.2) | ppm/℃ | x | 12 |
| y | 14 |
| z | 50 |
| Shrinkage Factor | Cook in boiling water for 2 hours | % | <0.0002 |
| Surface Resistivity | 500V DC | Normal State | M.Ω | ≧1 x 106 |
| Constant heat and humidity | ≧1 x 105 |
| Volume Resistivity | Normal State | MΩ.cm | ≧1 x 107 |
| Constant Heat and Humidity | ≧1 x 106 |
| Surface Electrical Resistance Strength | Normal State | δ=1mm(Kv/mm) | ≧1.2 |
| Constant Heat and Humidity | ≧1.1 |
| Dielectric Constant | 10GHz | εr | 2.85 ±0.05 | 2.94 ±0.05 | 2.55 ±0.05 |
| 3.00 ±0.05 | 3.20 ±0.05 | 2.65 ±0.05 |
| 3.38 ±0.05 | 3.50 ±0.05 | |
| 4.00 ±0.08 | 4.40 ±0.1 | |
| 6.15 ±0.15 | 10.2 ±0.25 | |
| Temperature Coefficient of Dielectric Constant | Dielectric Constant | Value |
| 2.55 2.65 | -90 |
| 2.85 2.94 | -85 |
| 3.0 3.2 | -75 |
| 3.38 | -65 |
| 3.5 4.0 4.4 | -60 |
| 6.15 | -55 |
| 10.2 | -50 |
| Dissipation Factor | 10 GHz | tgδ | 2.55-3.0 | ≦1.5 x 10-3 |
| tgδ | 3.0-3.5 | ≦2.0 x 10-2 |
| tgδ | 4.0-10.2 | ≦2.5 x 10-2 |
| Flame Retardant Resistance | UL94 V-0 |
Our PCB Capability(F4BTM-1/2)
| PCB Material: | Fibre glass coated PTFE |
| Code: | F4BTM-1/2 (family series) |
| Dielectric constant: | 2.55, 2.65, 2.85, 2.94, 3.0, 3.2, 3.38, 3.5, 4.0, 4.4, 6.15, 10.2 |
| Layer count: | 1 Layer, 2 Layers and multi-layer |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm) |
| PCB thickness: | 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 31mil (0.787mm), 44mil (1.016mm), 50mil (1.27mm), 60mil (1.524mm), 79mil (2.0mm),118mil (3.0mm), 158mil (4.0mm), 197mil (5.0mm), 236mil (6.0mm), 354mil (9.0mm), 394mil (10.0mm), 472mil (12.0mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion Silver, Immersin Tin, OSP,etc. |
High Frequency Materials
Rogers RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO3003, RO3035, RO3006, RO3010, RO3210, RO3203, etc.
Rogers RT/duroid 5880, RT/duroid 5870, RT/duroid 6002, RT/duroid 6010, RT/duroid 6035HTC etc.
Rogers TMM4, TMM10, Kappa 438 etc.
PTFE F4B (DK2.2, DK2.65, DK2.85, DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2)
Taconic TLX-0, TLX-9, TLX-8, TLX-7, TLX-6, TLY-5, TLY-3, RF-35, RF-35TC, TLF-35, RF-60A, RF-60TC, RF-35A2,RF-45, TRF-45 etc.
AD450, AD600, AD1000, TC350 etc.
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F4B High Frequency PCB DK 4.4 PTFE Microwave PCB 6.0mm RF PCB With Immersion Tin Images
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